Electronics thermal management


Due to the development of technology and the manufacturing technology, the high performance and high integration of electronic components throughout the industry, including the data processing field, Electric Vehicle, etc. is occurring. In such electronic devices with high power density, thermal runaway phenomenon, which has not appeared in the past, occurs, and there is an increasing interest in thermal management to solve such problems. In particular, in order to solve the above-mentioned problems, researches for improving the cooling performance for simultaneously cooling multiple heat sources having high energy density and optimization thereof must be performed indispensably.

In MEL, based on the optimal design of the flow path of cooling module for multiple heat sources by numerical design, we performs CFD analysis to optimize the thermal management performance and the experimental procedure to verify the validity of the extracted data. Low pressure drop, volume reduction due to miniaturization, and high cooling performance).