Since the technology is going to develop further, the devices are getting smaller and have a high power density. Due to the device’s size and power, the devices have the high heat flux above 100 W/cm2. To handle the high heat fluxes devices, many researchers are interested in the phase change based heat transfer such as thin-film evaporation in thermal management of microelectronics devices. The thin film evaporation relies on the phase-change of a thin liquid film ( < 2 μm ) from the liquid–vapor interface of an extended meniscus near the three phase contact line. The thin film evaporation provides high heat transfer rate due to low thermal resistance.
MEL designs the various wick structures to improve the heat transfer rate and capillary performance such as dual height superhydrophilic micropost.